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Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with what it says is the industry’s first single-chip passive infrared (IR) MEMS temperature sensor.

The TMP006 digital temperature sensor provides manufacturers of mobile devices, such as smartphones, tablets and notebooks, with the ability to accurately measure device case temperature using IR technology.

This advancement over the current approach of approximating case temperature based on system temperature will enable system designers to optimize performance while providing a more comfortable user experience.

The TMP0006 can also be used to measure temperature outside the device, enabling new features and user applications.

It integrates an on-chip MEMS thermopile sensor, signal conditioning, a 16-bit analogue-to-digital-converter (ADC), local temperature sensor and voltage references on a single 1.6 x 1.6mm chip.

It provides a complete digital solution for contactless temperature measurement that is 95 per cent smaller than any other thermopile sensor.

Features: integrates MEMS sensor with supporting analogue circuitry, uses only 240uA quiescent current and 1uA in shutdown mode; supports a temperature range of -40 to 125C with an accuracy of +/- 0.5C (typical) on the local sensor and accuracy of +/-1C (typical) for the passive IR sensor; includes I2C/SMBus digital interface; complements TI’s portfolio of ultra-small, low-power-consumption analogue and embedded processing products for portable applications, including battery management, interface, audio codecs and wireless connectivity devices.

An evaluation module is available now for the TMP006, along with an IBIS model to verify board-signal integrity requirements and full source code for calculating object temperature and application notes.


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